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Through-Hole Technology: The Original PCB Assembly Method

Through-Hole Technology: The Original PCB Assembly Method

Through-hole technology inserts component leads through drilled holes in PCBs for wave soldering — older than SMT but still used for connectors and power components.

Through-hole technology (THT) is a PCB assembly method in which component leads are inserted through holes drilled in the circuit board and soldered to pads on the opposite side, typically via wave soldering (passing the board over a wave of molten solder). ## History Through-hole was the dominant assembly method from the 1950s through the 1980s. Components — DIP (dual inline package) ICs, axial resistors, radial capacitors — had wire leads designed for insertion. This allowed hand assembly and repair, making it accessible to hobbyists and small-scale manufacturers. ## Decline and Persistence Surface Mount Technology: The PCB Assembly Method Behind All Modern Electronics (SMT) largely replaced through-hole for most components starting in the 1980s, offering higher density, smaller size, and automated assembly. However, through-hole remains standard for: - **Connectors**: USB, Ethernet, power jacks — components subject to mechanical stress - **Power components**: Large capacitors, transformers, voltage regulators - **High-reliability**: Through-hole joints are mechanically stronger than SMT - **Prototyping**: Breadboard-compatible components for development ## Mixed Technology Most modern production boards use a mix: SMT for the majority of components and through-hole for specific high-stress or high-power parts, assembled in separate passes through the production line.

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Hardware

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April 13, 2026

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